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publications
Noise Immune Cascaded Gate Driver Solution for Driving High Speed GaN Power Devices
Published in 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 2021
This paper investigates the impact of high dv/dt induced noise on gate drive performance in GaN HEMTs.
An Isolated Voltage Injection Based Hybrid Circuit Breaker for MVDC Applications
Published in 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 2021
This paper presents design and validation of a MVDC Hybrid Circuit Breaker (HCB) that consists of an electro-mechanical switch (EMS) in series with a voltage injector building block (VIBB).
An Integrated Magnetic Structure for Bi-Directional Two-Channel Interleaved Boost Converter with Coupled Inductor
Published in 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 2021
This paper presents an integrated inducto, based on gapped EE-core is proposed, that combines both CM and DM inductances in a single core for an interleaved boost converter.
A Comprehensive Analysis of Current Spikes in a Split-Phase Inverter
Published in 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 2022
This paper presents a comprehensive analysis of current spikes in a split phase inverter with SPWM, characterized by the load power factor (PF).
Cognitive Insights into Metaheuristic Digital Twin based Health Monitoring of DC-DC Converters
Published in 2022 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe), 2022
This paper extends the concept of Digital Twin for health monitoring of DC-DC converters and analyzes the performance of Particle Swarm Optimization (PSO) and Genetic Algorithm (GA).
A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)
Published in ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2022
This paper presents a three-face utilized heat sink design for a 3-D integrated SiC-based 75 kVA grid interface bi-directional converter.
Design and Validation of a Grid-Integrable Medium-Voltage Hybrid DC Circuit Breaker
Published in Stony Brook University, 2022
This dissertation presents a MVDC Hybrid Circuit Breaker (HCB) that consists of an electro-mechanical switch (EMS) in series with the Voltage Injector Building Block (VIBB).
Design and Validation of a MVDC Isolated Active Voltage Injection Based HCB
Published in IEEE Transactions on Industry Applications, 2023
This article presents a MVDC Hybrid Circuit Breaker (HCB) design comprising an electro-mechanical switch in series a Voltage Injector Building Block (VIBB) with LV power semiconductor devices.
An E-Core Based Integrated Coupled Inductor for Interleaved Boost Converter
Published in IEEE Transactions on Industry Applications, 2023
This article presents an Integrated Magnetic Structure (IMS), based on a gapped EE-core, is proposed for Interleaved Boost Converter that combines both CM and DM inductances in a single core.
Hardware Design and Implementation of a 75 kVA 3-D Integrated Intelligent Power Stage
Published in 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2023
This paper presents the hardware design and validation of a SiC-based 75 kVA grid interface power converter for the Intelligent Power Stage (IPS) concept, proposed by Oak Ridge National Laboratory (ORNL).
Investigation of Common-Mode EMI in Three-Phase Split-Phase Inverter
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023
This paper investigates conducted CM EMI emission of a SiC-based Two-Level Split-Phase (2L-SP) three-phase inverter with SPWM.
Impact of PCB Parasitic Capacitance on Switching Transients in Split-Phase Inverter Utilizing TO-247 SiC Devices
Published in 2023 IEEE Energy Conversion Congress and Exposition (ECCE), 2023
This paper analyzes the effect of PCB parasitic capacitance on switching transients in a two-level Split-Phase (2L-SP) inverter phase-leg with SiC devices in TO-247 package.
Split Inductor Design Considerations for Split-Phase Three-Phase Inverter
Published in 2023 IEEE Energy Conversion Congress and Exposition (ECCE), 2023
This paper presents an analysis on the current spike phenomenon in Split-Phase topology and subsequently proposes split-inductor design considerations.
Converter-Level Packaging and Optimization for a SiC-based Grid-Interface Converter Using Discrete Devices
Published in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024
This article presents an electro-mechanical-thermal design and packaging of a two-stage SiC-based 75 kVA GIC using TO-247 discrete devices with two times lower cost-to-power ratio than power modules.
Simplified Analytical Modeling of Reflected Wave Transients in Cable-Connected VSI-Based Motor Drives With Output Reactor
Published in IEEE Transactions on Power Electronics, 2024
This article presents a simplified lumped Differential Mode (DM) model for estimating slew rates (dv/dt and di/dt) and peaks of reflected wave transients in two-level motor drive with output reactor.
Electro-Mechanical-Thermal Co-Design and Side Effect Mitigation for a 75 kVA SiC-Based Intelligent Grid-Interface Bidirectional Converter
Published in Stony Brook University, 2024
This dissertation proposes a two-stage SiC-based 75 kVA Intelligent Grid-Interface Bidirectional Converter (IGIBC), comprising DC-DC and DC-AC power stages with standardized interconnects. Moreover, it also explores into design of integrated magnetic structures for interleaved boost converter and side effect mitigation in 2L SiC-based power electronic converters.
Investigation of Reflected Wave Phenomenon in SiC-based Two-Level Split-Phase Inverter-Fed Motor Drives
Published in IEEE Transactions on Power Electronics, 2025
This article investigates Reflected Wave Phenomenon in a Two-Level Split-Phase (2L-SP) cable-connected motor drive, similar to the conventional 2L motor driver with output reactor.
Impact of PCB Parasitic Capacitance on Switching Transients in Chopper and Half-Bridge Configurations Utilizing TO-247 SiC Devices
Published in IEEE Transactions on Industry Applications, 2025
This article analyzes the effect of PCB capacitance on turn-OFF switching transient and ringing in chopper and half-bridge configurations with SiC devices in the TO-247 package.
talks
Talk 1 on Relevant Topic in Your Field
Published:
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Conference Proceeding talk 3 on Relevant Topic in Your Field
Published:
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teaching
Teaching experience 1
Undergraduate course, University 1, Department, 2014
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Teaching experience 2
Workshop, University 1, Department, 2015
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