Hardware Design and Implementation of a 75 kVA 3-D Integrated Intelligent Power Stage

Abdul Basit Mirza, Asif Imran Emon, Kushan Choksi, Sama Salehi Vala, Fang Luo, Radha Krishna Moorthy and Madhu Sudhan Chinthavali
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2023
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Abstract: With a vision to increase power density and standardize power electronics interface with the grid, this paper presents the design and validation of a SiC-based 75 kVA Intelligent Power Stage (IPS), comprising DC-DC and DC-AC power stages. The IPS is built on a modular 3D structure platform, where all three sides of the heat sink are utilized to achieve high power density (5.5 kW/L), including passives. The heat sink is custom-built and optimized to channel power from all three sides. Moreover, the intelligent features involve online non-invasive health monitoring of power stage components through a pseudo-optimized Digital Twin (DT) approach. DT also aids in identifying system failure modes, providing an extra layer of protection. Lastly, for grid-tie operation and interoperability, a hierarchical controller Smart Universal Power Electronics Regulator (SUPER) is proposed, which controls the DC-AC stage and monitors the health of IPS components through control and data communication channels.

Recommended citation (BibTex):

@INPROCEEDINGS{MirzaAPEC2023, 
 author={Mirza, Abdul Basit and Emon, Asif Imran and Choksi, Kushan and Vala, Sama Salehi and Luo, Fang and Moorthy, Radha Krishna and Chinthavali, Madhu Sudhan}, 
 booktitle={2023 IEEE Applied Power Electronics Conference and Exposition (APEC)}, 
 title={Hardware Design and Implementation of a 75 kVA 3-D Integrated Intelligent Power Stage}, 
 year={2023}, 
 volume={}, 
 number={}, 
 pages={977-983}, 
 doi={10.1109/APEC43580.2023.10131647} 
}